Ivy Bridge and temperature: a problem of TIM confirmed

TIM (for Thermal Interface Material) is a thin layer of thermal paste between the nucleus and the IHS. Intel would have used a somewhat limited TIM which results in a rise in temperature important in overclocking on the Ivy Bridge.

Our Japanese colleagues from PC Watch had fun to disassemble a third-generation Intel Core, Core i7-3770K CPU to be exact, and analyzed the impact of the thermal paste between the nucleus and the IHS (Integrated Heat Spreader) used by Intel. As we have seen in testing of overclocking the processor by our expert Thomas "Pt1t" Kerrinckx, the heater is much more important than expected. The emitted doubts writing is confirmed by tests of Japanese and used thermal paste is not the most effective.

In the design of a processor, the caster has two solutions, it pastes the IHS on the ring with a thermal paste either it directly welded the IHS on the ring. In both cases, the heat emitted by the nucleus must be evacuated at best to the heatpipe itself intercalated with a thin layer of thermal paste. The image of PC Watch above illustrates this point, with black kernel, in red the two layers of pulp thermal (the bottom being posed by Intel and the top by the user) and clear grey the IHS on the dark grey that represents the base of installed heatpipe.

Our Intel Core i7-3770K decapsulation...

Thus, the Overclocking can engage in the gurgling on this generation of processors to then put a new layer brand, as the paste OCZ Freeze Extreme or the Coollaboratory Liquid Pro. The results are without appeal and the performance of the pulp used by Intel inhibits the potential of OC of Ivy Bridge. The decapping operation is not without risk still and the gain may be minimal if the processor is not of good quality. However, PC Watch tests show a difference of 15 to 20 ° C reference processor and the modified processor, which allows up to 5 GHz to 1.55 V without any configuration plant during the Cinebench 11.5 multi-threaded test in the case of Liquid Pro.

                  

A table and a record of temperatures by PC Watch

Remains to be seen if revisions of these third-generation Intel processors will correct this problem with the pulp of better quality, or with an IHS directly welded to cut short just this controversy... But nothing is less sure.

The boost of Tegra 3 seems to be confirmed, pending Tegra 4

Frequencies of functioning identified and GPU accelerated, these are the elements of the SoC Tegra 3 AP37 that Nvidia is going out...

A few interesting details about the new versions of the 3 Nvidia Tegra SoC make their appearance on the canvas and tend to confirm that this all-in-one processor will be entitled to a kick boost at the level of performance in the meantime Tegra 4, code name Wayne, which is now known as the AP40 reference.

Currently, the tablets and smartphones that are equipped with a chip Tegra 3 are of a SoC which reference is AP33. As explained in this article, it is suspected that an AP37 (engraved in 28 nm) quickly make its appearance. And as shown in the table below (borrowed from VR-Zone), this new variation will be more efficient with an operating frequency reviewed higher (between 1.5 and 1.7 GHz), a faster GPU by 25% and the management of screen up to 1920 x 1200 pixels.

It is in any year end, at best, that could be a priori subsequently. Wayne so the Tegra 4 (AP40) which will be based on ARM Cortex A15 hearts. Nvidia partners who will design a Tegra 4 processor equipped products expect to receive the first samples about a month after the Computex, or this summer. Computex that Nvidia could decide in good and due form to its Tegra 4, even if it is a little early.