Intel: worms of the wafers of 450 mm engraved in the extreme ultraviolet

An important investment between a manufacturer and the skier to accelerate and reduce the fineness of engraving of chips and processors of tomorrow.

The launch of the latest processors Intel Ivy Bridge serious 22 nm made aware the skier will have to find new technical solutions quickly for more finely burn again and again. Today, the exposure to extreme ultraviolet lithography is still little used and costly for the cross-country skier from Santa Clara. But the situation could change with the signing of a partnership with ASML.

In exchange for nearly $ 4 billion of investments to acquire 15% of the company ASML, Intel will make profit on the possibility to manufacture wafers of 450 mm and EUV (Extreme Ultraviolet) lithography. For the record, ASML is a manufacturer offering large machinery for manufacturing and engraving of processors and other chips in foundries.

"The transition from a size of wafer to another to usually reduce by 30-40% the cost of production, what we also hope from 300 mm to 450 mm to get a similar benefit." "Pus quickly we will do, faster we will get this benefit to improve the production, which will create tremendous value for our customers and our partners," says Brian Krzanich, Vice president and Director of operations for Intel.

Is that these investments are early stage and a production of chips etched in EUV development is planned for late 2013, while the 450 mm wafers will arrive late 2015... If the plan is proceeding as planned.

ZOTAC GTX 670: the Extreme Edition special overclocking

The Zotac mark will soon be a third model of GeForce GTX 670 to the overclockers, the GTX 670 Extreme Edition.

The Chinese manufacturer Zotac, after having announced its classic and AMP models! Edition of the GeForce GTX 670, would prepare a third version known as the Extreme Edition. It would be more for overclockers and demanding users who wish to make the most of their equipment.

Indeed, this map is completely customisée, long PCB was enhanced to provide 8 + 3 phases, cooled by an additional radiator on the top of the card with LED integrated to illuminate the logo. The map will then require connectors PCI-e 8 + 6 pins to feed energy.

The cooling system consists of a large copper base surmounted by a large radiator finned aluminum covering the PCB, crossed by 5 heat pipes 9 mm brass, all rafraichi by two fans of 90 mm diameter. The card has a backplate for stiffening the whole and dissipate heat, a module + OC can also connect in USB on the map to relate it to the motherboard to monitor and precisely control the various parameters of the card (GPU/memory frequency, tension, speed of the ventilos…).

     

ZOTAC announces an overclocking of plant for the GK104 amounting to 1100 Mhz in standard and 1200 Mhz in GPU Boost, the 2 GB of GDDR5 is processors to 1650 Mhz (1502/980/915 Mhz for the GTX 670 of reference NVIDIA). This model will be the month next in Asia at a rate not release and arrival on the European market has not yet been mentioned.